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HDI PCB (High Density Interconnect) 2 + N + 2
Material:FR-4 High Tg
Board Thickness:1.2mm
Layer:10 Layers
Surface Finished:ENIG:2μ" / 150μ" (Electroless Nickel Immersion Gold)
Copper Weight:1.0 oz
HDI (High Density Interconnect) 1 + N + 1
Laser Drill / Vias are plating and filled with copper:L1 - L2
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