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HDI PCB (High Density Interconnect ) 1 + N + 1
Material:FR-4 High Tg
Board Thickness:1.6mm
Layers:6 Layers
Surface Finished:ENIG (Electroless Nickel Immersion Gold)
Copper Weight:1.0 oz.
HDI (High Density Interconnect) 1 + N + 1
Laser Drill / Vias are plating and filled with copper:L1 - L2
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