Products
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Special Process
VIA IN/ON PAD
VIA IN/ON PAD
Description:
Plated through holes filled with conductive (or non-conductive) epoxy plugging ink, subsequently planarized and plated over. The via in pad approach places a via directly under the device’s contact pads. This allows higher component density and improved routing. Consequently, via in pad provides the designer significant PCB space savings.
Business Hours
CHEER TIME Office
No. 311,Qionglin S. Rd., Xinzhuang Dist., New Taipei City 24264, Taiwan, R.O.C.
T/ +886-2-2205-2032
F/ +886-2-2205-3346
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