Products
Quality is the only insistence.
Special Process
VIA IN/ON PAD
VIA IN/ON PAD
Description:
Plated through holes filled with conductive (or non-conductive) epoxy plugging ink, subsequently planarized and plated over. The via in pad approach places a via directly under the device’s contact pads. This allows higher component density and improved routing. Consequently, via in pad provides the designer significant PCB space savings.
Bread crumb
CHEER TIME Office
Subscribe to our newsletter